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Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ).
STANDARD published on 1.3.2011
Designation standards: DIN EN 60191-6-20:2011-03
Publication date standards: 1.3.2011
SKU: NS-236839
The number of pages: 14
Approximate weight : 42 g (0.09 lbs)
Country: German technical standard
Category: Technical standards DIN
Electrical and electronics engineering drawingsMechanical structures for electronic equipment
Mechanische Normung von Halbleiterbauelementen - Teil 6-20: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Messverfahren für Gehäusemaße von kleinen Gehäusen mit J-förmigen Anschlüssen (SOJ).
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